BST Interdigital VCDL

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Project: Voltage-Controlled Delay Lines using Interdigital BST Varactors
Investigators: Bruce Liu, Troy Taylor, Pete Hansen, Jim Speck, Baki Acikel, Bob York
Funded by: DARPA FAME Program
Description:
UCSB has pioneered the development of monolithic VCDLs that are specifically optimized for low insertion loss (see Nagra, MTT Sept 99).  The BST interdigital varactor topology allows for an exceedingly simple and low-cost implementation of the VCDL, requiring minial materials and fabrication complexity.  The interdigital varactor structure is a single, top-layer metalization scheme deposited directly on the thin-film ferroelectric layer, which in turn is directly deposited on a dielectric substrate.  Since the BST is grown directly on the substrate (rather than a refractory base electrode), different microstructural and electrical characteristics are expected.  This topology also allows for the use of high conductivity electrodes for minimizing series resistance in the varactor.  The tradeoff is a lower tunability as compared with MIM (parallel-plate) structures, and high control voltages.  

Our work concentrates on low-cost glass and sapphire substrates.  To minimize the control voltage, we use our i-line stepper for 1 micron gaps in the interdigital structure, leading to a typical control voltage range of 0-90V for 100nm BST films (50% tunability).   An X-band VCDL (shown at right) has been fabricated with >360 degress of differential delay and a 53o/dB figure of merit.  This circuit uses 98 individual BST varactors.

Viewgraphs: 360o X-band Interdigital VCDL

 Papers:
bulletY. Liu, A.S. Nagra, E.G. Erker, P. Periaswamy, T.R. Taylor, J.S. Speck and R.A. York, “BaSrTiO3 Interdigitated Capacitors for Distributed Phase Shifter Applications”, IEEE Microwave Guided Wave Lett, vol. 10, pp.448-450,  Nov 2000
bulletA.S. Nagra and R.A. York, "Distributed analog phase shifters with low insertion loss", IEEE Trans. Microwave Theory Tech., vol. 47, no. 9, pp. 1705-1711, September 1999.